Samsung Galaxy S4 Teardown

Disassembly Process

Below is a photography of all the parts spread out under the order of assembly:

List of materials and techniques used for each component:

  1. Back panel (plastic) – injection molding
  2. Mid-frame (plastic) – injection molding
  3. Lithium battery (lithium)
  4. Screws (metal)
  5. Mid-frame connector panel (plastic) – injection molding
  6. Rear facing camera (metal&glass&copper)
  7. SIM micro-sd board (metal&copper)
  8. Volume button (plastic)
  9. Earpiece Speaker (metal&glass&copper)
  10. Motherboard (metal&copper)
  11. Vibrator (metal&copper)
  12. Front facing camera (metal&glass&copper)
  13. Top front shell (plastic)
  14. Back front shell (plastic)
  15. Insulating tape (resin&plastic&fiber)
  16. Home-key press (plastic)
  17. Home button (metal&copper)
  18. Circuitboard (metal) – necessary software/operating system
  19. Screen monitor (glass)
  20. Screen monitor protector (metal)
  21. Front screen frame (plastic)

Information of Chips:

  1. K4P2E304EQ-AGC2: Microprocessor
  2. KLM8G1WEMB-B031: Memory card
  3. 20794MA: Gravity Sensing
  4. WCD9306: Audio IC
  5. PM8226: Power IC
  6. WCN3660a: Wifi IC
  7. Q16DWUUIG: Flash Memory

Tools Used:

  1. Cross-screwdriver
  2. Tweezers

It’s not hard for me to unscrew using a proper screwdriver, however, getting rid of the mid-frame is quite difficult for me without destroying the structure underneath. I had to slip my tweezer under the mid-frame and carefully separate it from the adhesives, and repeat the process all around under I could easily remove the frame.

Design Elements:

There are two components that I’m interested in, one is the back panel of this phone. Unlike other designs from that period where battery is generally not accessible, this panel makes the battery accessible with no tools required. Another fact that attracts my attention, is the leather covered design of this panel, which provides an unique pleasing to the eye while distinguishing it with other cellphones on the market.

Besides the back panel, I was also fascinated by the meticulous motherboard with several tiny little chips connected. The chips are way smaller than my imagination, some of them are even too small for me to recognize as a chip. I struggled for a while to identify the correct numbers/letters printed on the chip. However, it is exactly those tiny chips that enables the design of a thinner and lighter cellphone today.

Hi, I’m Gaoming :)

I’m from Fujian, China. Before studying at PoD, I was majored in Graphic Design at Binghamton University. During my 4-year undergraduate, I was a layout designer for the campus newspaper organization-Pipe Dream, I enjoyed arranging photos and texts within the newspaper page, and catching up the deadlines every midnight.

I’m also really into theater productions, especially musicals. I enjoyed seeing plays so much that I decided to obtain a minor in theater technical productions. While working at the woodshop building varies sceneries, I was able to learn how to cut woods, paint scenes, and cooperate with the team to construct the stage.

Upon my experiences, I’ve never get to work with electronics before, so I’m very excited and worried about the upcoming Arduino project at the same time. And I believe whatever the outcomes, it would become a great experience for me.